Product Applications>Semiconductor Manufacturing Equipment>Automatic High-precision Eutectic Die Bonding Machine

Semiconductor Manufacturing Equipment

Automatic High-precision Eutectic Die Bonding Machine

The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (15-35s/pcs) and high precision (0.5-3μm) . This series serves functions of eutectic bonding, dipping glue bonding and Flip Chip bonding. It is also able to meet the needs of multi-chip bonding. Its modular design enables the equipment to have highly flexible manufacturing capability. Also, equipped with an intelligent calibration and data management system, the MicroStar Series is capable to trace and manage process.

Parameters
  • Patch efficiency
    15~35s/pcs
  • Patch accuracy
    ±0.5~±3μm
Advantages
  • Eutectic bonding, dipping glue bonding and Flip Chip bonding.
    Meet the needs of multi-chip bonding

  • Its modular design enables the equipment to have highly flexible manufacturing capability

  • with an intelligent calibration and data management system, capable to trace and manage process.

Relatives
  • Wechat scan

  • Official video Number